Home > Speakers > Daniel Bossel

Daniel Bossel

Country: Switzerland
Company: Bosch Packaging Technology
Connect: LinkedIN

Biography

Daniel Bossel is Global Product Manager at Bosch Packaging Technology. He is based in Beringen, Switzerland. Since 2011, Daniel is responsible for biscuit packaging systems, ranging from biscuit processing up to retail packaging.

He started his packaging curriculum in the pharmaceutical industry. Afterwards, he worked at Amcor Ltd. where he was responsible for packaging material science and innovations for more than ten years.

BPC2019

The influence of biscuit market trends on development and innovation in the packaging industry

Over the coming years, biscuit recipes, consumer behavior and retail channels will continue to change.
This change will have a great impact on biscuit – and equipment manufacturers as well as packaging suppliers. The challenge will be to stay up to date with the ever changing consumer demand and market expectations while complying with new regulations at the same time.

Biscuit People Conference

Join Us in Curitiba, Brasil
October 2.-4. 2024.

Become a Sponsor

The global biscuit industry overview

ABOUT THE CONFERENCE

BPC brings together leading industry executives, independent consultants and other biscuit experts to explore and exchange their knowledge, experience and industry innovations.